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Introduction of 8 common metal materials and metal surface treatment process (8)

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4. Vapor deposition

Vapor deposition technology refers to a new type of coating technology which deposits vapor substances containing sedimentary elements on surface of materials to form thin films by physical or chemical means.

According to principle of deposition process, vapor deposition technology can be divided into physical vapor deposition (PVD) and chemical vapor deposition (CVD).

Physical vapor deposition (PVD)

Physical vapor deposition (PVD) refers to technique of making materials vaporize into atoms, molecules or ionized into ions under vacuum conditions, and depositing a thin film on surface of materials through gas phase process.

Physical deposition technology mainly includes vacuum evaporation, sputtering and ion plating. 

Physical vapor deposition has a wide range of suitable matrix materials and film materials. Simple process, material saving, no pollution; Obtained film has advantages of strong adhesion, uniform film thickness, compactness and less pinhole. It is widely used in machinery, aerospace, electronics, optics and light industry to prepare films that are wear-resistant, corrosion-resistant, heat-resistant, conductive, insulating, optical, magnetic, piezoelectric, smooth and superconducting.

Chemical vapor deposition (CVD)

Chemical vapor deposition (CVD) is a method of forming metal or compound films on surface of a substrate by interacting with a mixture of gases at a certain temperature.

Chemical vapor deposition (CVD) film has been widely used in mechanical manufacturing, aviation and aerospace, transportation, coal chemical industry and other industries due to its good abrasion resistance, corrosion resistance, heat resistance, electrical and optical properties.


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